Ihr Partner für Mikromontagelösungen
Willkommen bei Paroteq
Paroteq ist ein führendes deutsches Technologieunternehmen, das sich auf hochwertige Handhabungs- und Automatisierungslösungen für Mikromontageanwendungen spezialisiert hat. Mit Sitz in Hennigsdorf bei Berlin entwickeln und fertigen wir innovative Maschinen und Werkzeuge für präzise Montageprozesse.
Erfahren Sie mehr über unsere Lösungen
Kontaktieren Sie uns
Entdecken Sie, wie Paroteq Ihre Produktionseffizienz steigern kann. Wir stehen Ihnen gerne zur Verfügung, um Ihnen individuelle Lösungen anzubieten.
H-System Die/Flip Chip Bonder CTA
Highlights:
- Fully automated
- Small footprint
- Immediately productive
- Versatile use
- Cycle time <5 sec.
The H-System CTA marks a revolutionary milestone in precision assembly, bridging the gap between manual flexibility and full automation. Engineered for industrial-grade reproducibility, it features fully motorized positioning powered by the industry-leading Cognex Pattern Recognition System. Whether processing components individually or in series, the system ensures flawless alignment for bare dies and PET inlays. Experience the ultimate synergy of motorized accuracy and intuitive control, designed to elevate your production standards.
H-System Die/Flip Chip Bonder GA
Highlights:
- Beam splitter optics
- Second z - axis
- HMTPA (high magnified two point alignment)
- Free programmable automated bond process
- Compact design
- Cycle time <5 sec.
The HFB-System PRE marks a revolutionary milestone in precision assembly, bridging the gap between manual flexibility and full automation. Engineered for industrial-grade reproducibility, it features fully motorized positioning powered by the industry-leading Cognex Pattern Recognition System. Whether processing components individually or in series, the system ensures flawless alignment for bare dies and PET inlays. Experience the ultimate synergy of motorized accuracy and intuitive control, designed to elevate your production standards.