Beyond Bonding: Engineering Solutions for Complex Micro-Assembly
At Paroteq, we engineer the future of micro-assembly. Our advanced die and flip chip bonders deliver unparalleled accuracy and reliability, empowering breakthroughs in semiconductor manufacturing, photonics, and advanced packaging. Explore how our solutions elevate your precision.
19
Years of Industry Experience
8
Countries with Active Installations
100%
Quality Control and Testing Standards
Paroteq Map
Why Paroteq
We bridge the gap between innovation and mass production by offering risk-free sample validation and state-of-the-art machinery engineered to meet the most demanding standards of the modern semiconductor industry.
Built for the Long Haul
Our "Machines and Tools" are famous for their durability. We ensure long-term spare part availability and software updates to protect your investment for years to come.
Plug-and-Play Precision
Our systems are designed to integrate perfectly into your existing MES and production environments, ensuring a smooth transition from installation to full-scale output.
Flexible Solutions
From Thermocompression to Epoxy bonding—our systems are designed to handle a vast array of substrates and die sizes with ease.
Precision Packaging Powering Diverse Industries
Paroteq delivers advanced high-density packaging solutions that are fundamental to innovation and performance across diverse sectors. From enabling the next generation of electric vehicles and securing defense systems, to powering cutting-edge communications and advancing medical technology, our precision solutions ensure reliability and drive progress in your most demanding applications.
Automotive & E-Mobility
High-precision die bonding is essential for the SiC and GaN power electronics that drive modern Electric Vehicles (EVs). Our machines ensure the thermal reliability needed for next-gen inverters and battery management.
Defence
Space and defense electronics face the ultimate reliability test. Our processes ensure long-term stability for satellite transceivers and aerospace sensors, bridging the gap between innovative research and field-ready deployment.
Communcations
Flip Chip bonding provides the high-frequency performance required for 5G infrastructure. By minimizing signal loss through shorter interconnects, our technology powers the routers and transceivers of tomorrow.
Medical Technology
In the medical field, failure is not an option. Our bonding solutions are used to assemble ultra-reliable MEMS sensors and diagnostic micro-optics found in everything from pacemakers to lab-on-a-chip devices.
Die/Flip Chip Bonder
Our semi automatic die bonder platforms offer maximum flexibility and precision for research, development, and prototyping. Ideal when versatile applications and intuitive operation are required.
Modules
Perfect for diverse research, streamlined development, and efficient prototyping, our modules provide intuitive operation for all your versatile application requirements. Power your progress with intelligent design.
Proof of concept
Tailored Bonding Solutions for Your Samples
Don't leave your precision to chance. We offer a dedicated sample bonding service where our engineers process your specific dies and substrates according to your exact requirements. Gain total peace of mind by seeing your components handled with sub-micron accuracy before making any commitment.
How to find us
Address:
Paroteq GmbH
Walter-Kleinow-Ring 7A
1. Etage links
16761 Hennigsdorf (near Berlin)
Germany
Telefon: +49 (0) 6930588
E-Mail: info@paroteq.de
Contact Form
