Pick-Up Tools
For the assembly of various components in the fields of mechanics, electronics and optoelectronics Paroteq provides assembly tools which are optimally adapted to the particular application. These tools can use passive coplanarity adjustment to ensure a coplanar assembly.
Technical Specifications
- various vacuum designs
- shaft diameter: 1,5 - 6 mm
Technologies
- Thermo-compression bonding (eutectic bonding Au/sn, Au/Au bonding)
- Adhesive bonding
Applications
- Die Bonding
- MEMS / MOEMS assembly
- Sensor assembly
- Assembly of optical components
- Laser bar bonding
Secondary Z-Axis
Paroteq bonders are equipped with a primary and secondary Z-axis for handling components.
The primary Z-axis (Z1) is combined with our split field optic as standard, enabling high-precision alignment of components to substrates.
The secondary Z-axis (Z2) can be used to support other modules required for the joining process, such as dispensing, pick-up, or camera. The working position of the secondary Z-axis can be referenced in paroPro to the secondary Z-axis to enable optical alignment of the modules located on the axis.
Dynamic Heater
For bonding of the mounted components Paroteq offers heaters for pick-up tools and heating plates which ensure a reproducible compliance of particular bonding parameters by their dynamic heating characteristics. Moreover their low thermal mass guarantees a reduction of the heat input into the assembly system.
Technical Specifications
- up to 50k/S
- up to 450 °C
- active cooling
- thermocouple type K or PT100
- various vacuum designs
Options
- shielding gas chamber for heating plate
- flow meter for shielding gas chamber 1-10 LPM
- mechanical component clamping
- vacuum clamping
- additional vacuum for flexible substrates
Applications
- Die Bonding
- MEMS / MOEMS assembly
- Sensor assembly
- Assembly of optical components
Split Field Optic
Split Field Optic is a module for the simultaneous optical superimposition of two opposing objects. It can be used wherever it is possible to place two objects that are aligned approximately parallel to each other between the split field optics. The two objects can now be superimposed simultaneously or, thanks to our new shutter function, viewed and/or manipulated separately from each other without any optical loss. At Paroteq, Split Field Optic is an integral part of our Die Bonder systems and is used for high-precision alignment of the joining partners.
To keep distortion to a minimum, telecentric lenses with different magnifications are used. Furthermore, it is possible to use coaxial and/or oblique lighting for the individual objects.
This makes it possible to adapt the Split Field Optic precisely to the requirements of the individual objects to be viewed and the installation situation.
Options:
- Coaxial lighting for top/bottom
- Angled lighting for top
- Angled lighting for bottom
- Various working distances
- Various magnifications
- Various cameras
- Various actuators (DC/ Stepper - Motors)
