H-System GA Die/Flip Chip Bonder

The H-System GA is a versatile placement system featuring an overhead gantry configuration with integrated beam splitter optics. This configuration ensures a maximum working area with a minimal footprint as a benchtop unit. The integrated beam splitter optics for real-time image overlay enable the operator to align components and substrates intuitively and precisely. The force-controlled Z-axis accommodates varying bond heights and ensures a reproducible bonding process. A second Z-axis can be used without tool changes for loading or unloading single or connected components, as well as for dispensing, dipping, or stamping. Integrated heating plates, heated holders, or dispensers support the respective bonding process. The H-System GA supports all current and future bonding technologies and applications in the field of microsystems engineering. The H-System GA runs on paroPro, a proprietary software interface developed by Paroteq that enables intuitive and flexible control of high-precision micro-assembly processes.