H-System CTA Die/Flip Chip Bonder
The H-System CTA is a robust die bonder built on a granite base, ensuring maximum stability and repeatable precision. It is designed for both prototype development and series production. The system features a cross-table configuration, real-time beam splitter optics, and a placement accuracy of 1 µm. Thanks to its modular Z-axes and advanced bonding capabilities, it is suitable for a wide range of micro-assembly applications, making it ideal for the manufacture of electronics, photonics, and medical devices. The H-System CTA is operated using paroPro, a proprietary software interface developed by Paroteq that enables intuitive and flexible control of high-precision micro-assembly processes.
Applications
- Die bonding
- Flip Chip Bonding
- CoS (chip on Submount)
- MEMS / MOEMS assembly
- Sensor assembly
- Assembly of optical components (photo diodes, laser diodes)
- Assembly of lenses and lens arrays
- Laser bar bonding
- Assembly of mechanical components
- Sorting of components
- Assembly of medical parts
Options
- HMTPA (high magnified two point alignment)
- Different light sources
- Dispensing / stamping
- UV-curing
- Heated pick-up tools
- Heating plates with and w/o vacuum structure
- Coplanarity tools
- Process gas chamber
- Process gas suction
- Support plate with vacuum
- Input-/output station with or without vacuum
- Height adjustable bond stage
Technologies
- Thermo-compression bonding (eutectic bonding Au/Sn, Au/Au bonding)
- Ultrasonic - or thermosonic bonding
- Adhesive bonding
- Dispensing
- Dipping
- Stamping
- UV curing
Technical Specifications
- Granite table with x, y and theta stage on steel frame
- Beam splitter optics
- Freely adjustable assembly process
- Bond force: 10 - 500cN
- Positioning accuracy: 1 micron
- Maximum component size 25mm x 25mm
- Maximum substrate size 150mm x 200mm
- Foot print: 800mm x 1200mm x 1400mm (LxWxH)
