split optics

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The HFB-System in stable granite frame arrangement with integrated beam splitter optics is the new member from the Paroteq semi automatic die bonder family.

Be it for lower volume production or for R&D purposes this stand alone semi-automatic pick-and-place die bonder offers quick results yet with exceptional placement accuracy. This arrangement guarantees a maximum of stability at high bond forces as well as a maximum working range using minimal footprint.

  • adjustable bond force up to 1000N
  • levelable and height adjustable stage
  • network ready
HFB-System
 

Products

 

H-System - Bonding platform

Pick-and-place system with dispenser and heating plate
Pick-and-place system with dispenser and heating plate
Dispenser and heating plate on the H-System
Dispenser and heating plate on the H-System
Heating plate
Stage with heating plate 25x25 and mounting for 4x wafflepack
Versatile pick-and-place system in overhead gantry arrangement with integrated beam splitter optics for an accurate and reproducible adjustment by means of direct and visual overlay. For micro assembly applications such as die bonding or flip chip bonding.

Highlights:


The H-system is a versatile pick-and-place system in overhead gantry arrangement with integrated beam splitter optics. This arrangement ensures a maximum working range by minimal footprint as a desktop device. The integrated beam splitter optics for real time-image overlays allows the operator an intuitive and accurate alignment of component and substrate by means of micrometer screws. The programming of the Z axis for different bond altitudes guarantees a reproducible connecting process. Integrated heating plates, heated pick up tools or dispenser support the respective bond process. The H-system supports all topical and future connecting technologies and applications in the area of micro systems technology.

Technical specifications

  • beam splitter optics
  • HD zoom camera with 18 optical zoom
  • fully programmable Z-axis
  • bond force: 15 - 500cN
  • positioning accuracy: ± 5 micron
  • precision screws for X- and Y-axis
  • maximum component size:
    50 mm x 50 mm (2" x 2")
  • maximum substrate size:
    300 mm x 300 mm (12" x 12")
  • work area:
    300 mm x 240 mm x 100 mm (12" x 9,5" x 4")

Options

  • dispenser
  • heating plates
  • heated pick up tools
  • support plate with vacuum
  • input-/output station with or without vacuum
  • HD inspection camera

Applications

  • Die Bonding
  • Flip Chip Bonding
  • MEMS / MOEMS
  • sensor assembly
  • assembly of optical components (photo diodes, laser diodes)
  • assembly of mechanical components
  • sorting of components

Technologies

  • thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding)
  • ultrasonic - or thermosonic bonding
  • adhesive bonding
  • dispensing
  • paste printing

Video


HFB-System – Small Footprint High Force Bonding Platform

HFB-System
Pick-and-place system with high force capability
air cushion table on HFB-System
Air cushion table on HFB-System
Dispenser and split optics on HFB-System
Dispenser and split optics on HFB-System
Versatile pick-and-place system in stable granite frame arrangement with integrated beam splitter optics for micro assembly applications such as high force die bonding or high force flip chip bonding.

Highlights:


The HFB-System is a versatile handling system designed for micro assembly applications like high force die bonding or component handling. With the integrated dual imaging optics in combination with the programmable Z-stage this system is well suited for reproducible bonding of electronic and opto-electronic components. A physically generated overlay live image allows the operator in combination with a user friendly program interface to intuitively perform the component alignment and bonding. This arrangement guarantees a maximum of stability at high bond forces as well as a maximum working range using minimal footprint. Available options such as different heating plates, heated placement tools, or dispenser further extend the usability of the system. The HFB-system supports all topical and future connecting technologies and applications in the area of micro systems technology.

Technical specifications

  • beam splitter optics
  • fully programmable bond process
  • air cushion table with fine adjustement for x- and y-axis
  • levelable and height adjustable stage
  • HD camera with optical zoom
  • bond force: 0.2 - 1000N
  • positioning accuracy: ± 5 microns
  • maximum component size 15mm x 15mm
  • maximum substrate size 25mm x 25mm
  • working area: 175mm x 150mm

Options

  • two point alignment
  • ultrasonic generator
  • dispenser
  • heated pick-up tools
  • heating plates
  • process gas suction
  • different light sources
  • support plate with vacuum
  • input-/output station with or without vacuum
  • HD inspection camera

Applications

  • High force Die bonding
  • High force Flip Chip Bonding / Montage
  • MEMS / MOEMS assembly
  • sensor assembly
  • assembly of optical components (photo diodes, laser diodes)
  • assembly of mechanical components
  • sorting of components

Technologies

  • thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding)
  • ultrasonic - and thermosonic bonding
  • CoS (Chip on Submount)
  • adhesive bonding
  • dispensing
  • paste printing
 

Modules

 

Pick up tools

Pick-up tools
Pick-up tools
Coplanarity tool
Coplanarity tool
Tab bond tool mit Parallelitätsausgleich, Dimension: 25 mm x 2 mm
Tab bond tool , Dimension: 25 mm x 2 mm
Component-saving placement with coplanarity adjustment and dynamic heater.

For the assembly of various components in the fields of mechanics, electronics and optoelectronics Paroteq provides assembly tools which are optimally adapted to the particular application. These tools use passive coplanarity adjustment to ensure a coplanar assembly.

Technical specifications

  • up to 50k/S
  • up to 450 °C
  • coplanarity adjustment for component-saving placement
  • thermocouple type K or PT100
  • any vacuum structure
  • shaft diameter: 3 - 6 mm

Applications

  • Die bonding
  • Laser bar bonding
  • MEMS / MOEMS assembly
  • Sensor assembly
  • Assembly of optical components

Technologies

  • Thermo-compression bonding (eutectic bonding, Au/Au bonding, Au/Sn bonding
  • Adhesive bonding

Dynamic heaters

 
 
Heating plate 25x25
Heating plate 25x25
Dynamic heaters for micro assembly

For bonding of the mounted components Paroteq offers heaters for pick-up tools and heating plates which ensure a reproducible compliance of particular bonding parameters by their dynamic heating characteristics. Moreover their low thermal mass guarantees a reduction of the heat input into the assembly system.

Technical specifications

  • up to 50k/S
  • up to 450 °C
  • active cooling
  • 10mm height adjustment
  • thermocouple type K or PT100
  • any vacuum structure

Options

  • shielding gas chamber for heating plate
  • flow meter for shielding gas chamber 1-10 LPM
  • mechanical component clamping
  • vacuum clamping
  • additional vacuum for flexible substrates
  • temperature profiles with ramps

Applications

  • Die Bonding
  • MEMS / MOEMS assembly
  • Sensor assembly
  • Assembly of optical components

Technologies

  • Thermo-compression bonding (Eutectic bonding, Au/Au bonding, Au/Sn bonding)
  • Adhesive bonding

Quality assurance

 
Glass scale at coaxial lighting (detail view)
Glass scale at coaxial lighting (overview)
Universally applicable glass scales for quality assurance and adjustment of manual and automatical, imaging microsystems with a resolution of 0,5 - 10 µm

Testing and adjusting

Our glass scales allow precise statements about the assembly accuracy of pick-and-place systems. Moreover the glass scales can be used to check the accuracy of image processing systems (PRS - pattern recognition system) on automatic assembly systems.

Technical specifications

  • 6 mm x 8 mm x 0,5 mm (bottom)
  • 5 mm x 4 mm x 0,5 mm (top)
  • 0,5 - 10 µm resolution on one scale
  • opaque chrome structure in transparent environment

Applications

  • for testing and adjustment of the positioning accuracy of micro systems ( e.g. pick-and-place machines for chip adjustment)
  • checking of positioning systems with image processing ( PRS, pattern recognition system)
  • Machine capability studies (CMK)

Accessories

  • vacuum pick-up tool
  • vacuum suction plate
 

Company

 

What we do

Paroteq GmbH is an innovative developer of high quality handling and automation solutions from the area of micro assembly.
We provide our customers with individual and application-oriented systems and tools for precision processes such as flip chip bonding or die bonding. As a company with international expertise in the field of micro assembly we develop and produce semiautomatic positioning – and bond systems, modules for optical alignment, heating systems for thermo compression bonding as well as a wide range of pick-up tools for component handling in micro system technology.
As a result of combining our modules and subsystems we create individual bond systems, which can be used for engineering, prototype construction and production in the fields of electronics, optoelectronics, medical and micro systems technology.

Career

Paroteq ist ein Unternehmen aus dem Bereich der Entwicklung und Fertigung von Sondermaschinen für Mikromontage -Applikationen mit Sitz in Hennigsdorf bei Berlin. Zu unseren Leistungen zählen der gesamte Entwicklungsprozess der Geräte von der Entwicklung bis zur Montage und die kunden –und anwendungsspezifische Anpassung der Geräte sowie die Entwicklung und den Verkauf von hochwertigem Zubehör-Equipment.
Zur Verstärkung unseres Teams bieten wir zum nächstmöglichen Zeitpunkt qualifizierte und zuverlässige Mitarbeiter in den Positionen:

Studentischer Mitarbeiter (m/w) aus dem Bereich Mechatronik


  • Gute Kenntnisse im Umgang mit SolidWorks
  • Kenntnise der SPS-Programmierung
  • Gute handwerkliche Fähigkeiten für die Herstellung und Montage der Geräte
  • Grundkenntnisse der Elektrotechnik
  • Gute Englisch-Kenntnisse
  • Strukturierte Arbeitsweise, Aufgeschlossenheit und ein freundliches Wesen

Industriemechaniker (m/w)


Was Sie erwartet:

  • Herstellen von Produktionsanlagen der Mikrosystemtechnik
  • Baugruppenmontage, Verdrahtung und Inbetriebnahme
  • Einrichten und Einstellen von Maschinen und Systemen
  • Durchführen von Qualitätskontrollen
  • Fräsen, Drehen, Bohren

Was Sie mitbringen sollten:

  • Abgeschlossene Berufsausbildung als Industriemechaniker (m/w)
  • Strukturierte, selbständige Arbeitsweise, Aufgeschlossenheit und ein freundliches Wesen
  • Erfahrungen in der Feingerätetechnik wünschenswert, aber nicht zwingend erforderlich
  • Freude an der Arbeit im Team
Was wir bieten:

  • Ein freundliches und kreatives Arbeitsklima in einem jungen Unternehmen
  • Gemeinsame Arbeit an Projekten statt isolierter Beschäftigung
  • Flexible Arbeitszeiten (auch an Wochenenden möglich)
  • Abwechslungsreiche Tätigkeiten
  • Eine angemessene Vergütung
Haben wir Ihr Interesse geweckt? Dann schicken Sie uns Ihre vollständigen Bewerbungsunterlagen bitte an mechatroniker@paroteq.de.
 

Imprint

disclosures in § 5(1) N0. 1,2 Telemedia Act

Responsible for content:
Paroteq GmbH

Represented by:
CEO: Udo Hartwig

Contact:
Walter-Kleinow-Ring 7A
16761 Hennigsdorf (bei Berlin)
Deutschland
Telefon: +49 (0)3302 8982901
E-Mail: info@paroteq.de
http://www.paroteq.de

USt-IdNr.: DE295628812
Handelsregisternr.: HRB.10746 NP

Disclaimer

All due precautions and efforts were taken in the compilation of this website in order to keep the information contained as current, correct and clear as possible. Despite the greatest diligence unintentional misinformation cannot be ruled out. Paroteq therefore refuse any responsibility especially for typing or printig errors and for the exactness, completeness and topicality of the information provided on the website of the company. The information and data provided on the Paroteq website may be altered at any time without prior announcement. They are provided by Paroteq without any obligation and exclude any warranty. As far as the Paroteq website contains links or pointers to a third party website, Paroteq does not accept any responsibility for any information, material or link contained in them. We expressly declare that we do not in any case agree with the contents of linking pages. By visiting the Paroteq website you alone take over any risk of damage to your computer, software or data by viruses or other software which is transferred or activated via the Paroteq website or your visit to it. In no case can Paroteq be held responible for any direct, indirect, special, concomitant or subsequent damage or escaped profit resulting from the use or misuse of information or from incomplete information on the Paroteq website.

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How to find us

Contact

Paroteq GmbH
Walter-Kleinow-Ring 7A
1. Etage links
16761 Hennigsdorf (near Berlin)
Germany
Telephone: +49 (0)3302 8982901
Telefax: +49 (0)3303 5488714
E-Mail: info@paroteq.de
Web: www.paroteq.de
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Pick-and-place system with dispenser and heating plate
Pick-and-place system with dispenser and heating plate

Key features H-system
  • beam splitter optics for precise alignment
  • fully programmable Z-axis
  • compact design
HFB-System
Pick-and-place system with high force capability

Key features HFB-system
  • adjustable bond force up to 1000N
  • levelable and height adjustable stage
  • network ready
Heated pick-up tool
Heated pick-up tool

Key features heated pick-up tool
  • up to 50k/s
  • up to 450°C
  • coplanarity adjustment
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